


K200 Development Kit
Utilize the powerful processing power of Qualcomm® Snapdragon™ QCS605 SoC (System on Chip) also known as Qualcomm® Intelligent Image Processing Platform, the K200 ODK manufactured by BHS is the perfect reference design for AIoT cameras.
By combining the Qualcomm® artificial intelligence engine with BHS' industry expertise in imaging products, you're guaranteed the best in class for your edge computing needs.
Product Features


Flexible design options for commercialization
the platform offers ready-made System on Modules (SoM) solutions.


Advanced image processing capabilities
Encode: 5.7K30/4K60 8-bit: HEVC/H.264 + 1080P60
Decode: 5.7K30/4K60 10-bit: HEVC/VPc9/H.264, HDR 10


Integrate Qualcomm's Artificial Intelligence (AI) Engine
Applications


Artificial intelligence (AI)


Industrial control


Internet of Things (IOT)


Robotics


Virtual reality (VR)


Augmented reality (AR)


Drones and medical equipment
Hardware Block Diagram
System Information
SOM on board
QCS605 SOM
OS Support
Android-based
CC SDK – Framework QMMF for
recording and playback
CPU
Custom 64-bit ARM v8-compliant
octa-core CPU
Up to 2.5 GHz,10nm process
GPU
Qualcomm Adreno 615 GPU
OpenGL ES 3.2, Vulkan, DX 12.x
OpenCL 2.x, Microsoft DirectCompute,
RenderScript
DSP
Qualcomm Hexagon V65 DSP
RAM
8GB LPDDR4x SDRAM @ 1866 MHz
Storage
16 GB eMMC 5.1 onboard storage
1 x MicroSD card slot
Ethernet
1 x GbE Ethernet
Wireless
WLAN 802.11 a/b/n/ac 2.4/5GHz 2x2
MIMO
Bluetooth 5.0
GPS
GPS/GLONASS
USB
1 x USB 3.1 Type C
Display
Two, 4-lane DSI D-PHY 1.2 or C-PHY
1.0; VESA DSC 1.1
1 x HDMI 1.4 (Type D - full) connector
Video
Encode: 5.7K30/4K60 8-bit: HEVC/H.264
+ 1080P60
Decode: 5.7K30/4K60 10-bit: HEVC/VP9/
H.264, HDR 10
Audio
AAC, PCM playback/record
Stereo encoder.
Camera
2x ISP 14 bit + 1x Lite ISP: 32 MP (2x
ISP, 16 + 16 MP)
16 + 16 IFEs, DxO 90, SHDR, MCTF,
fisheye dewarping, EIS
Expansion interfaces
J0809: 1 x 16 pin high-speed connector (4L- MIPI DSI1)
J0901: 1 x 50 pin high-speed connector (4L-MIPI CSI0, CAM MCLK x 1, GPIO x 11, I2C x 1, DC Power)
J0807: 1 x 16 pin high-speed connector (4L - MIPI CSI1)
J0806: 1 x 16 pin high-speed connector (4L - MIPI CSI2)
J0805: 1 x 30 pin low-speed connector ( LPI GPIO x 16, UART, I2C x 1, GPIO x 7, DC Power)
J0808: 1 x 30 pin low-speed connector (PMIC power on x 28, GPIO x 2)
J0803: 1 x 8 pin low-speed connector (JTAG x 6, GPIO x 1, DC Power)
J0801: 1 x 12 pin low-speed connector (LPI GPIO x 6, GPIO x 2, Audio codec x 4)
J0804: 1 x 6 pin low-speed connector (ALARM IN x 2, ALARM OUT x 1)
LED
3 Indicator LED
1 LED for Power Indicator
2 LED for LAN Ethernet block
Buttons
Power (on/off/reset)
Power source
12V - 1A adapter with a DC plug
(5.5x2.1mm)
PoE 802.3at/af with a RJ45 plug
Dimension
165 x 74x 51 mm
Item | Document Name |
---|---|
Documentation | Camera Specifications QCS605 Kit |
Documentation | Datasheet QCS605 SOM |
Documentation | Open Development Kit And User Guide |
Documentation | Schematic QCS605 Kit_SOM |
Documentation | Schematic QCS605 Kit_SUB |
Documentation | Reference Guide QCS605 KIT |
Documentation | User Guide QCS605 KIT |
Documentation | Mechanical File |